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Byoungdo Lee
Byoungdo Lee
SKhynix
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Title
Cited by
Cited by
Year
Aerodynamic performance of a gliding swallowtail butterfly wing model
H Park, K Bae, B Lee, WP Jeon, H Choi
Experimental Mechanics 50, 1313-1321, 2010
362010
Semiconductor chip and stacked type semiconductor package having the same
JH Kim, JH Son, B Do LEE, KJ Chun, WK Choi
US Patent 9,390,997, 2016
152016
Performance of different layers of graphene as protective coating for copper wire
B Lee, W Li
Materials Letters 273, 127875, 2020
132020
Effects of process parameters on graphene growth via low-pressure chemical vapor deposition
B Lee, W Chu, W Li
Journal of Micro-and Nano-Manufacturing 8 (3), 031005, 2020
122020
Mechanical and thermal characterization of TSV multi-chip stacked packages for reliable 3D IC applications
HY Son, T Oh, JW Hong, BD Lee, JH Shin, SH Kim, NS Kim
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 356-360, 2016
102016
Flow structures around a butterfly-shaped low-aspect-ratio wing
B Lee, J Seong, H Park, H Choi
Journal of Mechanical Science and Technology 28, 2669-2675, 2014
72014
Stack package and method for selecting chip in stack package
DW Lee, YG Hwang, JH Son, TM Kang, CK Yoon, B Do LEE, YH Kim
US Patent 8,810,309, 2014
52014
Stack package having flexible conductors
TM Kang, YK Hwang, JH Son, DW Lee, B Do LEE, YH Kim
US Patent 8,680,688, 2014
42014
Stack package having flexible conductors
TM Kang, YK Hwang, JH Son, DW Lee, B Do LEE, YH Kim
US Patent 8,288,873, 2012
42012
The Cooling Rate Effect on Graphene Synthesis Using Low Pressure Chemical Vapor Deposition
B Lee, W Chu, W Li
International Manufacturing Science and Engineering Conference 85079 …, 2021
12021
Effects of Twin Boundary and Precipitates on Board Level Reliability in Sn-Ag-Cu (SAC) Solder Joints through EBSD Analysis
DJ Yoon, B Lee, J Kim, S Hyun, G Lee, K Lee
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1091-1094, 2023
2023
Synthesis of High-Quality Graphene via Chemical Vapor Deposition
B Lee
The University of Texas at Austin, 2020
2020
Thick graphene transfer and RIE etching for chip cooling
W Choi, J Jeong, K Chun, B Do Lee
2013 IEEE International Conference of IEEE Region 10 (TENCON 2013), 1-4, 2013
2013
Stack semiconductor package and method for manufacturing the same
TM Kang, YK Hwang, JH Son, DW Lee, CK Yoon, B Do LEE, YH Kim
US Patent 8,164,200, 2012
2012
Vortical structures around a gliding swallowtail butterfly
H Park, B Lee, J Seong, H Choi
APS Division of Fluid Dynamics Meeting Abstracts 60, JF. 006, 2007
2007
글라이딩하는 제비나비 날개형상의 공력특성연구
이병도, 박형민, 최해천
대한기계학회 춘추학술대회, 1874-1877, 2007
2007
Aerodynamic Property of Swallowtail Butterfly Wing in Gliding
BD Lee, HM Park, HC Choi
Proceedings of the KSME Conference, 395-398, 2007
2007
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Articles 1–17