| Thermal resistance investigations on new leadframe-based LED packages and boards B Pardo, A Gasse, A Fargeix, J Jakovenko, RJ Werkhoven, X Perpiñà, ... Microelectronics Reliability 53 (8), 1084-1094, 2013 | 30 | 2013 |
| Thermal simulation and validation of 8W LED Lamp J Jakovenko, R Werkhoven, J Formánek, J Kunen, P Bolt, P Kulha 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and …, 2011 | 27 | 2011 |
| Piezoelectric response of AlGaN/GaN-based circular-HEMT structures T Lalinský, M Držík, G Vanko, M Vallo, V Kutiš, J Bruncko, Š Haščík, ... Microelectronic engineering 88 (8), 2424-2426, 2011 | 24 | 2011 |
| Thermal analysis of LED lamps for optimal driver integration X Perpina, RJ Werkhoven, M Vellvehi, J Jakovenko, X Jorda, JMG Kunen, ... IEEE Transactions on Power Electronics 30 (7), 3876-3891, 2014 | 15 | 2014 |
| A Powerful Optimization Tool for Analog Integrated Circuits Design. M KUBAŘ, J JAKOVENKO Radioengineering 22 (3), 2013 | 13 | 2013 |
| Design and Fabrication of 3D Electrostatic Energy Harvester. V Janicek, M Husak, J Jakovenko, J Formanek Radioengineering 21 (1), 2012 | 13 | 2012 |
| GaAs based micromachined thermal converter for gas sensors T Lalinský, M Držík, J Jakovenko, G Vanko, Ž Mozolová, Š Haščík, ... Sensors and Actuators A: Physical 142 (1), 147-152, 2008 | 13 | 2008 |
| GaN, GaAs and silicon based micromechanical free standing hot plates for gas sensors J Jakovenko, T Lalinsky, M Drzik, M Ivanova, G Vanko, M Husak Procedia Chemistry 1 (1), 804-807, 2009 | 12 | 2009 |
| Design for reliability of solid state lighting systems X Perpiñà, R Werkhoven, J Jakovenko, J Formánek, M Vellvehí, X Jordà, ... Microelectronics Reliability 52 (9-10), 2294-2300, 2012 | 11 | 2012 |
| High Power Solid State Retrofit Lamp Thermal Characterization and Modeling. J Jakovenko, J Formánek, V Janíček, M Husák, R Werkhoven Radioengineering 21 (1), 2012 | 11 | 2012 |
| Design and simulation of micromechanical thermal converter for RF power sensor microsystem J Jakovenko, M Husak, T Lalinsky Microelectronics Reliability 44 (1), 141-148, 2004 | 10 | 2004 |
| MEMCAD thermal simulation of GaAs based membrane bridge J Jakovenko, M Husak Proceedings of 12th Micromechanics Europe Workshop (MME’01), 225-228, 2001 | 10 | 2001 |
| Thermal characterization and lifetime prediction of LED boards for SSL lamp J Formanek, J Jakovenko Radioengineering 22 (1), 245-250, 2013 | 8 | 2013 |
| LED driver thermal design considerations for solid-state lighting technologies X Perpina, RJ Werkhoven, M Vellvehi, X Jorda, JMG Kunen, J Jakovenko, ... 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and …, 2012 | 8 | 2012 |
| Impact of ZnO gate interfacial layer on piezoelectric response of AlGaN/GaN C-HEMT based ring gate capacitor T Lalinský, G Vanko, M Vallo, M Držík, J Bruncko, J Jakovenko, V Kutiš, ... Sensors and Actuators A: Physical 172 (2), 386-391, 2011 | 8 | 2011 |
| Design methodologies for reliability of SSL LED boards J Jakovenko, J Formánek, X Perpiñà, X Jorda, M Vellvehí, RJ Werkhoven, ... Microelectronics Reliability 53 (8), 1076-1083, 2013 | 7 | 2013 |
| MEMS/NEMS handbook: Techniques and applications, Chapter 3, Ed T Lalinský, M Držík, J Jakovenko, M Husák CT Leondes, 49-109, 2006 | 6 | 2006 |
| Enhanced Generic Architecture for Safety Increase of True Random Number Generators V Kotě, V Molata, J Jakovenko Západočeská univerzita v Plzni, Fakulta elektrotechnická, 2014 | 5 | 2014 |
| AlGaN/GaN HEMT based micro-hotplate for high temperature gas sensors T Lalinský, G Vanko, J Jakovenko, V Kutiš, M Ivanova, Š Haščík, J Murín, ... MNE09. The 35th Inter. Conf. on Micro & Nano Engineering; Ghent 1 (1), 1, 2009 | 5 | 2009 |
| Micromechanical thermal converter device based on polyimide-fixed island structure T Lalinský, M Krnáč, Š Haščík, Ž Mozolová, L Matay, I Kostič, P Hrkút, ... International Journal of Computational Engineering Science 4 (03), 543-546, 2003 | 5 | 2003 |
Miroslav HusákCzech Technical University in PragueE-mailová adresa ověřena na: fel.cvut.cz
