| 3D-MAPS: 3D massively parallel processor with stacked memory SK Lim, SK Lim Design for High Performance, Low Power, and Reliable 3D Integrated Circuits …, 2013 | 225 | 2013 |
| Design, fabrication, and characterization of ultrathin 3-D glass interposers with through-package-vias at same pitch as TSVs in silicon V Sukumaran, G Kumar, K Ramachandran, Y Suzuki, K Demir, Y Sato, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (5 …, 2014 | 135 | 2014 |
| Design and analysis of 3D-MAPS (3D massively parallel processor with stacked memory) DH Kim, K Athikulwongse, MB Healy, MM Hossain, M Jung, I Khorosh, ... IEEE Transactions on Computers 64 (1), 112-125, 2013 | 84 | 2013 |
| Ultra-high I/O density glass/silicon interposers for high bandwidth smart mobile applications G Kumar, T Bandyopadhyay, V Sukumaran, V Sundaram, SK Lim, ... 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 217-223, 2011 | 63 | 2011 |
| Low-cost and low-loss 3D silicon interposer for high bandwidth logic-to-memory interconnections without TSV in the logic IC V Sundaram, Q Chen, Y Suzuki, G Kumar, F Liu, R Tummala 2012 IEEE 62nd Electronic Components and Technology Conference, 292-297, 2012 | 44 | 2012 |
| Modeling, fabrication, and characterization of low-cost and high-performance polycrystalline panel-based silicon interposer with through vias and redistribution layers Q Chen, Y Suzuki, G Kumar, V Sundaram, RR Tummala IEEE Transactions on Components, Packaging and Manufacturing Technology 4 …, 2014 | 28 | 2014 |
| Design and demonstration of power delivery networks with effective resonance suppression in double-sided 3-D glass interposer packages G Kumar, S Sitaraman, J Cho, V Sundaram, J Kim, RR Tummala IEEE Transactions on components, packaging and manufacturing technology 6 (1 …, 2015 | 17 | 2015 |
| Dengue maculopathy: a case report SY Tan, G Kumar, SK Surrun, YY Ong Travel Medicine and Infectious Disease 5 (1), 62-63, 2007 | 12 | 2007 |
| Shreepad Panth DH Kim, K Athikulwongse, MB Healy, M Hossain, M Jung, I Khorosh, ... Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin …, 2012 | 9 | 2012 |
| Aggressively voltage overscaled adaptive RF systems using error control at the bit and symbol levels J Natarajan, G Kumar, S Sen, MM Nisar, D Lee, A Chatterjee 2009 15th IEEE International On-Line Testing Symposium, 249-254, 2009 | 9 | 2009 |
| Coaxial through-package-vias (TPVs) for enhancing power integrity in 3D double-side glass interposers G Kumar, PM Raj, J Cho, S Gandhi, P Chakraborti, V Sundaram, J Kim, ... 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 541-547, 2014 | 8 | 2014 |
| Power delivery network analysis of 3D double-side glass interposers for high bandwidth applications G Kumar, S Sitaraman, J Cho, SJ Kim, V Sundaram, J Kim, R Tummala 2013 IEEE 63rd Electronic Components and Technology Conference, 1100-1108, 2013 | 8 | 2013 |
| Modeling and design of an ultra-miniaturized WLAN sub-system with chip-last embedded PA and digital dies G Kumar, S Sitaraman, V Sridharan, N Sankaran, F Liu, N Kumbhat, ... 2012 IEEE 62nd Electronic Components and Technology Conference, 1015-1022, 2012 | 4 | 2012 |
| Physics-driven Regression Algorithm on Solder Joint Fatigue Life Prediction for Mobile SiP Packages FX Che, YC Ong, HW Ng, L Pan, K Sinha, C Glancey, G Kumar 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 420-425, 2023 | 3 | 2023 |
| Methodology of Artificial Intelligence Aided Hybrid Modeling for Predicting Solder Joint Reliability of BGA Package L Pan, F Che, YC Ong, HW Ng, C Glancey, G Kumar 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1200-1204, 2023 | 2 | 2023 |
| Modeling, design, fabrication and characterization of power delivery networks and resonance suppression in double-sided 3-D glass interposer packages G Kumar Georgia Institute of Technology, 2015 | 2 | 2015 |
| 3D Glass and Silicon Interposers with TPV vs. 3D ICs with TSV R Tummala Additional Papers and Presentations 2012 (DPC), 000757-000790, 2012 | 1 | 2012 |
| Investigation on memory package crack and prevention under temperature cycling test FX Che, YC Ong, HW Ng, CL Gan, G Kumar Materials Science in Semiconductor Processing 180, 108560, 2024 | | 2024 |
| Significance of Die Shadow Size and Placement on Solder Joint Reliability Performance BR Korpati, PNV Nune, K Sinha, C Glancey, G Kumar, YC Ong, HW Ng 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 1-3, 2024 | | 2024 |
| Leakage current based Thermal Design Approach for SSD Reliability R Nallavelli, PNV Nune, SR Yarragunta, C Glancey, G Kumar, YC Ong, ... 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 1-3, 2024 | | 2024 |
