| Multi-chip package and method of providing die-to-die interconnects in same H Braunisch, CP Chiu, A Aleksov, H Au, SM Lotz, JM Swan, S Sharan US Patent 8,227,904, 2012 | 235 | 2012 |
| Optical interconnect system integration for ultra-short-reach applications E Mohammed, A Alduino, T Thomas, H Braunisch, D Lu, J Heck, A Liu, ... Intel Technol. J 8 (2), 115-127, 2004 | 161 | 2004 |
| Bumpless build-up layer packaging SN Towle, H Braunisch, C Hu, RD Emery ASME Intl. Mech. Eng. Digest, 2001 | 138* | 2001 |
| Effects of random rough surface on absorption by conductors at microwave frequencies L Tsang, X Gu, H Braunisch IEEE microwave and wireless components letters 16 (4), 221-223, 2006 | 117 | 2006 |
| Methods and apparatus to mount a waveguide to a substrate H Braunisch, D Lu, N Arbizu US Patent 7,684,660, 2010 | 114 | 2010 |
| Quasi-magnetostatic solution for a conducting and permeable spheroid with arbitrary excitation CO Ao, H Braunisch, K O'Neill, JA Kong IEEE Transactions on Geoscience and Remote Sensing 40 (4), 887-897, 2002 | 90 | 2002 |
| Tapered wave with dominant polarization state for all angles of incidence H Braunisch, Y Zhang, CO Ao, SE Shih, YE Yang, KH Ding, JA Kong, ... IEEE Transactions on Antennas and Propagation 48 (7), 1086-1096, 2000 | 85 | 2000 |
| Low cost microelectronic circuit package S Towle, J Tang, JS Cuendet, H Braunisch, TS Dory US Patent 7,183,658, 2007 | 83 | 2007 |
| High-speed performance of Silicon Bridge die-to-die interconnects H Braunisch, A Aleksov, S Lotz, J Swan 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging …, 2011 | 76 | 2011 |
| Magnetoquasistatic response of conducting and permeable prolate spheroid under axial excitation H Braunisch, CO Ao, K O'Neill, JA Kong IEEE transactions on Geoscience and Remote Sensing 39 (12), 2689-2701, 2001 | 74 | 2001 |
| Optical I/O system using planar light-wave integrated circuit MJ Kobrinsky, H Braunisch, SM Liff, PL Chang, BA Block, JM Swan US Patent 9,507,086, 2016 | 73 | 2016 |
| Off-chip rough-metal-surface propagation loss modeling and correlation with measurements H Braunisch, X Gu, A Camacho-Bragado, L Tsang 2007 Proceedings 57th Electronic components and technology conference, 785-791, 2007 | 71 | 2007 |
| A multiplicative regularization approach for deblurring problems A Abubakar, PM Van Den Berg, TM Habashy, H Braunisch IEEE Transactions on Image Processing 13 (11), 1524-1532, 2004 | 71 | 2004 |
| Electromagnetic wave interaction of conducting object with rough surface by hybrid SPM/MOM technique Y Zhang, YE Yang, H Braunisch, JA Kong Journal of electromagnetic waves and applications 13, 983-984, 1999 | 67 | 1999 |
| Random rough surface effects on wave propagation in interconnects L Tsang, H Braunisch, R Ding, X Gu IEEE Transactions on Advanced Packaging 33 (4), 839-856, 2010 | 66 | 2010 |
| Integrated transformer structure and method of fabrication H Braunisch US Patent 7,280,024, 2007 | 58 | 2007 |
| Multi-chip package and method of providing die-to-die interconnects in same H Braunisch, CP Chiu, A Aleksov, SM Lotz, JM Swan, S Sharan US Patent 9,875,969, 2018 | 57 | 2018 |
| Input/output package architectures S Ganesan, K Aygun, C Ramaswamy, E Palmer, H Braunisch US Patent 8,188,594, 2012 | 57 | 2012 |
| An enhanced augmented electric-field integral equation formulation for dielectric objects T Xia, H Gan, M Wei, WC Chew, H Braunisch, Z Qian, K Aygün, A Aydiner IEEE Transactions on Antennas and Propagation 64 (6), 2339-2347, 2016 | 56 | 2016 |
| Modeling effects of random rough interface on power absorption between dielectric and conductive medium in 3-D problem X Gu, L Tsang, H Braunisch IEEE transactions on microwave theory and techniques 55 (3), 511-517, 2007 | 52 | 2007 |
