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Jason Kenney
Jason Kenney
E-mailová adresa ověřena na: amat.com
Název
Citace
Citace
Rok
Inductively coupled plasma source with symmetrical RF feed
JA Kenney, JD Carducci, KS Collins, R Fovell, K Ramaswamy, S Rauf
US Patent 9,928,987, 2018
3082018
Multiple coil inductively coupled plasma source with offset frequencies and double-walled shielding
JA Kenney, JD Carducci, KS Collins, R Fovell, K Ramaswamy, S Rauf
US Patent 10,170,279, 2019
2662019
Electrochemical machining with ultrashort voltage pulses: modelling of charging dynamics and feature profile evolution
JA Kenney, GS Hwang
Nanotechnology 16 (7), S309, 2005
622005
Two-dimensional computational model for electrochemical micromachining with ultrashort voltage pulses
JA Kenney, GS Hwang, W Shin
Applied physics letters 84 (19), 3774-3776, 2004
482004
Composite edge ring
O Joubert, JA Kenney, S Srinivasan, J Rogers, R Dhindsa, ...
US Patent App. 29/561,163, 2017
362017
Etching with atomic precision by using low electron temperature plasma
L Dorf, JC Wang, S Rauf, GA Monroy, Y Zhang, A Agarwal, J Kenney, ...
Journal of Physics D: Applied Physics 50 (27), 274003, 2017
362017
Three-dimensional model of magnetized capacitively coupled plasmas
S Rauf, J Kenney, K Collins
Journal of Applied Physics 105 (10), 2009
332009
Influence of inhomogeneous magnetic field on the characteristics of very high frequency capacitively coupled plasmas
K Bera, S Rauf, J Kenney, L Dorf, K Collins
Journal of Applied Physics 107 (5), 2010
272010
Etch trends in electrochemical machining with ultrashort voltage pulses: Predictions from theory and simulation
JA Kenney, GS Hwang
Electrochemical and Solid-State Letters 9 (1), D1, 2005
272005
Three-coil inductively coupled plasma source with individually controlled coil currents from a single RF power generator
L Dorf, S Rauf, J Liu, JA Kenney, A Nguyen, KS Collins, K Ramaswamy, ...
US Patent 9,082,591, 2015
232015
Three-coil inductively coupled plasma source with individually controlled coil currents from a single RF power generator
L Dorf, S Rauf, J Liu, JA Kenney, A Nguyen, KS Collins, K Ramaswamy, ...
US Patent 9,111,722, 2015
212015
Prediction of stochastic behavior in differential charging of nanopatterned dielectric surfaces during plasma processing
JA Kenney, GS Hwang
Journal of applied physics 101 (4), 2007
182007
Ion energy distribution functions in a dual-frequency low-pressure capacitively-coupled plasma: experiments and particle-in-cell simulation
JC Wang, P Tian, J Kenney, S Rauf, I Korolov, J Schulze
Plasma Sources Science and Technology 30 (7), 075031, 2021
162021
Inductively coupled plasma source with multiple dielectric windows and window-supporting structure
A Nguyen, KS Collins, K Ramaswamy, S Rauf, JD Carducci, ...
US Patent 9,896,769, 2018
162018
Symmetrical inductively coupled plasma source with coaxial RF feed and coaxial shielding
JA Kenney, JD Carducci, KS Collins, R Fovell, K Ramaswamy, S Rauf
US Patent 10,249,470, 2019
152019
Symmetrical inductively coupled plasma source with symmetrical flow chamber
A Nguyen, KS Collins, K Ramaswamy, S Rauf, JD Carducci, ...
US Patent 9,745,663, 2017
142017
Symmetrical inductively coupled plasma source with side RF feeds and RF distribution plates
JD Carducci, KS Collins, R Fovell, JA Kenney, K Ramaswamy, S Rauf
US Patent 9,082,590, 2015
142015
Process kit having reduced erosion sensitivity
JM Kim, X Zhao, JA Kenney, S Rauf
US Patent App. 12/259,981, 2010
142010
Method to modulate the wafer edge sheath in a plasma processing chamber
H Wang, A Husain, K Ramaswamy, JA Kenney, J Ludwig, C Zhang, ...
US Patent App. 15/957,054, 2018
122018
Effect of segmenting powered electrode on plasma uniformity in large-area capacitively coupled plasma discharge
Z Chen, J Kenney, S Rauf, K Collins, T Tanaka, N Hammond, J Kudela
IEEE Transactions on Plasma Science 39 (11), 2526-2527, 2011
122011
Systém momentálně nemůže danou operaci provést. Zkuste to znovu později.
Články 1–20