| Comparison of techniques to characterise the density, porosity and elastic modulus of porous low-k SiO2 xerogel films C Murray, C Flannery, I Streiter, SE Schulz, MR Baklanov, KP Mogilnikov, ... Microelectronic Engineering 60 (1-2), 133-141, 2002 | 79 | 2002 |
| Large-scale parallel arrays of silicon nanowires via block copolymer directed self-assembly Nanoscale, 4, 3228-3236, 2012 | 68 | 2012 |
| Characterization of thin-film aerogel porosity and stiffness with laser-generated surface acoustic waves CM Flannery, C Murray, I Streiter, SE Schulz Thin Solid Films 388 (1-2), 1-4, 2001 | 68 | 2001 |
| Modelling and analysis of a magnetic microactuator D De Bhailı́s, C Murray, M Duffy, J Alderman, G Kelly, SCÓ Mathúna Sensors and Actuators A: Physical 81 (1-3), 285-289, 2000 | 61 | 2000 |
| Gas phase controlled deposition of high quality large-area graphene films S Kumar, N McEvoy, T Lutz, GP Keeley, V Nicolosi, CP Murray, WJ Blau, ... Chemical communications 46 (9), 1422-1424, 2010 | 56 | 2010 |
| Characterization of silica xerogel films by variable-angle spectroscopic ellipsometry and infrared spectroscopy C Himcinschi, M Friedrich, C Murray, I Streiter, SE Schulz, T Gessner, ... Semiconductor science and technology 16 (9), 806, 2001 | 35 | 2001 |
| Less is more: Improved thermal stability and plasmonic response in Au films via the use of subnanometer Ti adhesion layers WM Abbott, CP Murray, C Zhong, C Smith, C McGuinness, E Rezvani, ... ACS applied materials & interfaces 11 (7), 7607-7614, 2019 | 22 | 2019 |
| Simulation of the dielectric constant of aerogels and estimation of their water content X Xiao, R Streiter, H Wolf, G Ruan, C Murray, T Gessner Microelectronic engineering 55 (1-4), 53-57, 2001 | 21 | 2001 |
| Interstitial modification of rare‐earth intermetallics R Skomski, C Murray, S Brennan, JMD Coey Journal of applied physics 73 (10), 6940-6942, 1993 | 20 | 1993 |
| Comparison of metal adhesion layers for Au films in thermoplasmonic applications WM Abbott, CP Murray, S Ní Lochlainn, F Bello, C Zhong, C Smith, ... ACS applied materials & interfaces 12 (11), 13503-13509, 2020 | 16 | 2020 |
| Modelling and analysis of a magnetic microactuator D Bhailís, C Murray, M Duffy, J Alderman, G Kelly, SCO Mathuna Sensors and Actuator A 81, 285-290, 2000 | 16 | 2000 |
| Nanocarbon interconnects combining vertical CNT interconnects and horizontal graphene lines R Ramos, A Fournier, M Fayolle, J Dijon, CP Murray, J McKenna 2016 IEEE International Interconnect Technology Conference/Advanced …, 2016 | 12 | 2016 |
| Desorption of hydrogen from Sm2Fe17: the role of water C Murray, N Dempsey, JMD Coey Journal of alloys and compounds 215 (1-2), 345-347, 1994 | 9 | 1994 |
| Microelectron. Eng C Murray, C Flannery, I Streiter, SE Schulz, MR Baklanov, KP Mogilnikov, ... | 6 | 2002 |
| Microelectron. Eng X Xiao, R Streiter, H Wolf, G Ruan, C Murray, T Gessner | 6 | 2001 |
| Remote plasma‐assisted CVD growth of carbon nanotubes in an optimised rapid thermal reactor N Peltekis, M Mausser, S Kumar, N McEvoy, C Murray, GS Duesberg Chemical Vapor Deposition 18 (1‐3), 17-21, 2012 | 5 | 2012 |
| Combining sub-nanometer adhesion and capping layers for thermally stable nanometer-thick Au films WM Abbott, CP Murray, F Bello, C Zhong, C Smith, C McGuinness, ... ACS Applied Nano Materials 3 (11), 10628-10633, 2020 | 4 | 2020 |
| Monolayer Capping Provides Close to Optimal Resistance to Laser Dewetting of Au Films CP Murray, D Mamyraimov, M Ali, C Downing, IM Povey, D McCloskey, ... ACS Applied Electronic Materials 5 (8), 4080-4093, 2023 | 1 | 2023 |
| Improved Performance & Thermal Stability in Plasmonic Films with Thinner Adhesion & Capping Layers WM Abbott, CP Murray, C Zhong, CM Smith, D McCloskey, JF Donegan 2018 Conference on Lasers and Electro-Optics (CLEO), 1-2, 2018 | 1 | 2018 |
| Thin-film aerogel porosity and stiffness characterized by Surface Acoustic Wave Spectroscopy CM Flannery, C Murray, MR Baklanov, I Streiter, SE Schulz MRS Online Proceedings Library (OPL) 714, L12. 7.1, 2001 | 1 | 2001 |
Georg S. DuesbergChair of Sensortechnology , Universität der Bundeswehr, MunichE-mailová adresa ověřena na: unibw.de
