| Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules Y Sato, S Sitaraman, V Sukumaran, B Chou, J Min, M Ono, C Karoui, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 1656-1661, 2013 | 34 | 2013 |
| Miniaturized bandpass filters as ultrathin 3-D IPDs and embedded thinfilms in 3-D glass modules S Sitaraman, V Sukumaran, MR Pulugurtha, Z Wu, Y Suzuki, Y Kim, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (9 …, 2017 | 27 | 2017 |
| Measurement and analysis of glass interposer power distribution network resonance effects on a high-speed through glass via channel Y Kim, J Cho, JJ Kim, K Kim, K Cho, S Kim, S Sitaraman, V Sundaram, ... IEEE Transactions on Electromagnetic Compatibility 58 (6), 1747-1759, 2016 | 22 | 2016 |
| System scaling with nanostructured power and RF components PM Raj, H Sharma, S Sitaraman, D Mishra, R Tummala Proceedings of the IEEE 105 (12), 2330-2346, 2017 | 21 | 2017 |
| Characterization of electrical properties of glass and transmission lines on thin glass up to 50 GHz WT Khan, J Tong, S Sitaraman, V Sundaram, R Tummala, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2138-2143, 2015 | 19 | 2015 |
| Tunable and miniaturized RF components with nanocomposite and nanolayered dielectrics PM Raj, P Chakraborti, H Sharma, KH Han, S Gandhi, S Sitaraman, ... 14th IEEE International Conference on Nanotechnology, 27-31, 2014 | 18 | 2014 |
| Design and demonstration of power delivery networks with effective resonance suppression in double-sided 3-D glass interposer packages G Kumar, S Sitaraman, J Cho, V Sundaram, J Kim, RR Tummala IEEE Transactions on components, packaging and manufacturing technology 6 (1 …, 2015 | 17 | 2015 |
| Glass interposer electromagnetic bandgap structure for efficient suppression of power/ground noise coupling Y Kim, J Cho, JJ Kim, K Cho, S Kim, S Sitaraman, V Sundaram, PM Raj, ... IEEE Transactions on Electromagnetic Compatibility 59 (3), 940-951, 2016 | 15 | 2016 |
| Modeling, design and demonstration of integrated electromagnetic shielding for miniaturized RF SOP glass packages S Sitaraman, J Min, MR Pulugurtha, MS Kim, V Sundaram, R Tummala 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1956-1960, 2015 | 14 | 2015 |
| Nanomagnetic thinfilms for advanced inductors and EMI shields in smart systems PM Raj, D Mishra, S Sitaraman, R Tummala Journal of Materials NanoScience 1 (1), 31-38, 2014 | 14 | 2014 |
| A holistic development framework for hybrid bonding S Sitaraman, L Jiang, S Dag, M Masoomi, Y Wang, P Lianto, J An, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 691-700, 2022 | 13 | 2022 |
| A V-band end-fire Yagi-Uda antenna on an ultra-thin glass packaging technology WT Khan, S Sitaraman, AL Vera, MR Pulugurtha, V Sundaram, ... 2015 European Microwave Conference (EuMC), 618-621, 2015 | 13 | 2015 |
| Novel nanostructured passives for RF and power applications: Nanopackaging with passive components PM Raj, P Chakraborti, D Mishra, H Sharma, S Gandhi, S Sitaraman, ... Nanopackaging: From Nanomaterials to the Atomic Scale: Proceedings of the …, 2015 | 11 | 2015 |
| Ultra-miniaturized WLAN RF receiver with chip-last GaAs embedded active V Sridharan, A Goyal, S Sitaraman, N Kumbhat, N Sankaran, H Chan, ... 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1371-1376, 2011 | 11 | 2011 |
| Glass-interposer electromagnetic bandgap structure with defected ground plane for broadband suppression of power/ground noise coupling Y Kim, J Cho, K Cho, J Park, S Kim, DH Kim, G Park, S Sitaraman, PM Raj, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (9 …, 2017 | 10 | 2017 |
| Nanomagnetic structures for inductive coupling and shielding in wireless charging applications D Mishra, S Sitaraman, S Gandhi, S Teng, PM Raj, H Sharma, R Tummala, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 941-945, 2015 | 8 | 2015 |
| Ultraminiaturized WLAN RF receiver module in thin organic substrate S Sitaraman, Y Suzuki, F Liu, N Kumbhat, SJ Kim, V Sundaram, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (8 …, 2014 | 8 | 2014 |
| Power delivery network analysis of 3D double-side glass interposers for high bandwidth applications G Kumar, S Sitaraman, J Cho, SJ Kim, V Sundaram, J Kim, R Tummala 2013 IEEE 63rd Electronic Components and Technology Conference, 1100-1108, 2013 | 8 | 2013 |
| Ultra-thin and ultra-small 3D double-side glass power modules with advanced inductors and capacitors S Gandhi, PM Raj, BC Chou, P Chakraborti, MS Kim, S Sitaraman, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 230-235, 2015 | 7 | 2015 |
| Modeling, design and demonstration of ultra-miniaturized glass PA modules with efficient thermal dissipation MS Kim, S Cho, J Min, MR Pulugurtha, N Huang, S Sitaraman, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1163-1167, 2015 | 7 | 2015 |
