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SRIKRISHNA SITARAMAN
SRIKRISHNA SITARAMAN
Marvell Semiconductor Technology
Verified email at marvell.com
Title
Cited by
Cited by
Year
Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules
Y Sato, S Sitaraman, V Sukumaran, B Chou, J Min, M Ono, C Karoui, ...
2013 IEEE 63rd Electronic Components and Technology Conference, 1656-1661, 2013
342013
Miniaturized bandpass filters as ultrathin 3-D IPDs and embedded thinfilms in 3-D glass modules
S Sitaraman, V Sukumaran, MR Pulugurtha, Z Wu, Y Suzuki, Y Kim, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (9 …, 2017
272017
Measurement and analysis of glass interposer power distribution network resonance effects on a high-speed through glass via channel
Y Kim, J Cho, JJ Kim, K Kim, K Cho, S Kim, S Sitaraman, V Sundaram, ...
IEEE Transactions on Electromagnetic Compatibility 58 (6), 1747-1759, 2016
222016
System scaling with nanostructured power and RF components
PM Raj, H Sharma, S Sitaraman, D Mishra, R Tummala
Proceedings of the IEEE 105 (12), 2330-2346, 2017
212017
Characterization of electrical properties of glass and transmission lines on thin glass up to 50 GHz
WT Khan, J Tong, S Sitaraman, V Sundaram, R Tummala, ...
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2138-2143, 2015
192015
Tunable and miniaturized RF components with nanocomposite and nanolayered dielectrics
PM Raj, P Chakraborti, H Sharma, KH Han, S Gandhi, S Sitaraman, ...
14th IEEE International Conference on Nanotechnology, 27-31, 2014
182014
Design and demonstration of power delivery networks with effective resonance suppression in double-sided 3-D glass interposer packages
G Kumar, S Sitaraman, J Cho, V Sundaram, J Kim, RR Tummala
IEEE Transactions on components, packaging and manufacturing technology 6 (1 …, 2015
172015
Glass interposer electromagnetic bandgap structure for efficient suppression of power/ground noise coupling
Y Kim, J Cho, JJ Kim, K Cho, S Kim, S Sitaraman, V Sundaram, PM Raj, ...
IEEE Transactions on Electromagnetic Compatibility 59 (3), 940-951, 2016
152016
Modeling, design and demonstration of integrated electromagnetic shielding for miniaturized RF SOP glass packages
S Sitaraman, J Min, MR Pulugurtha, MS Kim, V Sundaram, R Tummala
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1956-1960, 2015
142015
Nanomagnetic thinfilms for advanced inductors and EMI shields in smart systems
PM Raj, D Mishra, S Sitaraman, R Tummala
Journal of Materials NanoScience 1 (1), 31-38, 2014
142014
A holistic development framework for hybrid bonding
S Sitaraman, L Jiang, S Dag, M Masoomi, Y Wang, P Lianto, J An, ...
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 691-700, 2022
132022
A V-band end-fire Yagi-Uda antenna on an ultra-thin glass packaging technology
WT Khan, S Sitaraman, AL Vera, MR Pulugurtha, V Sundaram, ...
2015 European Microwave Conference (EuMC), 618-621, 2015
132015
Novel nanostructured passives for RF and power applications: Nanopackaging with passive components
PM Raj, P Chakraborti, D Mishra, H Sharma, S Gandhi, S Sitaraman, ...
Nanopackaging: From Nanomaterials to the Atomic Scale: Proceedings of the …, 2015
112015
Ultra-miniaturized WLAN RF receiver with chip-last GaAs embedded active
V Sridharan, A Goyal, S Sitaraman, N Kumbhat, N Sankaran, H Chan, ...
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1371-1376, 2011
112011
Glass-interposer electromagnetic bandgap structure with defected ground plane for broadband suppression of power/ground noise coupling
Y Kim, J Cho, K Cho, J Park, S Kim, DH Kim, G Park, S Sitaraman, PM Raj, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (9 …, 2017
102017
Nanomagnetic structures for inductive coupling and shielding in wireless charging applications
D Mishra, S Sitaraman, S Gandhi, S Teng, PM Raj, H Sharma, R Tummala, ...
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 941-945, 2015
82015
Ultraminiaturized WLAN RF receiver module in thin organic substrate
S Sitaraman, Y Suzuki, F Liu, N Kumbhat, SJ Kim, V Sundaram, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (8 …, 2014
82014
Power delivery network analysis of 3D double-side glass interposers for high bandwidth applications
G Kumar, S Sitaraman, J Cho, SJ Kim, V Sundaram, J Kim, R Tummala
2013 IEEE 63rd Electronic Components and Technology Conference, 1100-1108, 2013
82013
Ultra-thin and ultra-small 3D double-side glass power modules with advanced inductors and capacitors
S Gandhi, PM Raj, BC Chou, P Chakraborti, MS Kim, S Sitaraman, ...
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 230-235, 2015
72015
Modeling, design and demonstration of ultra-miniaturized glass PA modules with efficient thermal dissipation
MS Kim, S Cho, J Min, MR Pulugurtha, N Huang, S Sitaraman, ...
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1163-1167, 2015
72015
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