| Enhancement of electrical conductivity by Al-doped ZnO ceramic varistors A Sedky, A Al-Sawalha, AM Yassin Physica B: Condensed Matter 404 (20), 3519-3524, 2009 | 37 | 2009 |
| Microstructure evolution and tensile creep behavior of Sn–0.7 Cu lead-free solder reinforced with ZnO nanoparticles AF Abd El-Rehim, HY Zahran, AM Yassin Journal of Materials Science: Materials in Electronics 30, 2213-2223, 2019 | 21 | 2019 |
| Effect of TiO2 Nanoparticles Addition on the Thermal, Microstructural and Room-Temperature Creep Behavior of Sn-Zn Based Solder AM Yassin, HY Zahran, AF Abd El-Rehim Journal of Electronic Materials 47, 6984-6994, 2018 | 20 | 2018 |
| Effect of annealing and microstructure on the creep behaviour of an Sn–10 wt% Sb alloy A Yassin, RL Reuben, G Saad, MHN Beshai, SK Habib Proceedings of the Institution of Mechanical Engineers, Part L: Journal of …, 1999 | 10 | 1999 |
| Enhancement of electrical conductivity of ZnO ceramic varistor by Al doping A Sedky, A Al-Sawalha, AM Yassin Egypt. J. Solids 31 (2), 205-215, 2008 | 8 | 2008 |
| The Study of Microstructure and Creep Properties of Cu-Doped Sn-4wt% Ag and Sn-9wt% Zn Lead Free Solders with Annealing Temperature A Yassin, E Gomaa Physics Journal 1 (2), 163-171, 2015 | 5 | 2015 |
| Effect of BaTiO3 on the mechanical properties of nitrile-butadiene rubber (NBR) vulcanizates SS Ibrahim, M Abu-Abdeen, AM Yassin Egyptian J. of Solids 29 (1), 193-204, 2006 | 5 | 2006 |
| Augmented Reality System in Total Hip Arthroplasty Using Transverse Acetabular Ligament A Yassin, T Elarif, M Hefny International Journal of Intelligent Computing and Information Sciences 20 …, 2020 | 2 | 2020 |
| Effect of Annealing Temperature on the Electrical Resistivity of Sn-12wt% Sb Lead Free Solder Alloy AM Yassin Egypt. J. Solids 30 (2), 2007 | 2 | 2007 |
| Creep microstructure relationships in Sn-Sb and Sn-Sb-Cu alloys AM Yassin Heriot-Watt University, 1999 | 2 | 1999 |
| Augmented Reality Systems in Total Hip Arthroplasty A Yassin, T Elarif, M Hefny | 1 | 2019 |
| Effects of Zn and Sb additions on micro-structure, creep behavior and thermal properties of binary eutectic Sn-0.7% Cu lead-free solder AM Yassin Arab Journal of Nuclear Sciences and Applications 52 (3), 1-15, 2019 | | 2019 |
| Engineers, Part L: Journal of Materials Design A Yassin, RL Reuben, G Saad, MHN Beshai, SK Habib Proc Instn Mech Engrs 213 (Part L), 0 | | |
| Influence of Low Ti-Element Additions on The Microstructure, Melting Properties and Creep Behavior of Sn-Ag-Cu Lead Free Solders AM Yassin, RA Ismail, BA Khalifa Journal: Journal of Advances in Physics 14 (3), 0 | | |
