almaBTE: A solver of the space–time dependent Boltzmann transport equation for phonons in structured materials J Carrete, B Vermeersch, A Katre, A van Roekeghem, T Wang, ... Computer Physics Communications 220, 351-362, 2017 | 291 | 2017 |
Temperature and Thickness Dependences of the Anisotropic In‐Plane Thermal Conductivity of Black Phosphorus B Smith, B Vermeersch, J Carrete, E Ou, J Kim, N Mingo, D Akinwande, ... Advanced Materials 29 (5), 1603756, 2017 | 138 | 2017 |
Superdiffusive heat conduction in semiconductor alloys. I. Theoretical foundations B Vermeersch, J Carrete, N Mingo, A Shakouri Physical Review B 91 (8), 085202, 2015 | 133 | 2015 |
Superdiffusive heat conduction in semiconductor alloys. II. Truncated Lévy formalism for experimental analysis B Vermeersch, AMS Mohammed, G Pernot, YR Koh, A Shakouri Physical Review B 91 (8), 085203, 2015 | 103 | 2015 |
Full-field thermal imaging of quasiballistic crosstalk reduction in nanoscale devices A Ziabari, P Torres, B Vermeersch, Y Xuan, X Cartoixà, A Torelló, JH Bahk, ... Nature Communications 9 (1), 255, 2018 | 92 | 2018 |
Cross-plane heat conduction in thin films with ab-initio phonon dispersions and scattering rates B Vermeersch, J Carrete, N Mingo Applied Physics Letters 108 (19), 193104, 2016 | 62 | 2016 |
A fixed-angle heat spreading model for dynamic thermal characterization of rear-cooled substrates B Vermeersch, G De Mey Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management …, 2007 | 60 | 2007 |
Influence of substrate thickness on thermal impedance of microelectronic structures B Vermeersch, G De Mey Microelectronics reliability 47 (2-3), 437-443, 2007 | 53 | 2007 |
Direct observation of nanoscale Peltier and Joule Effects at metal–insulator domain walls in vanadium dioxide nanobeams T Favaloro, J Suh, B Vermeersch, K Liu, Y Gu, LQ Chen, KX Wang, J Wu, ... Nano letters 14 (5), 2394-2400, 2014 | 50 | 2014 |
Thermal impedance plots of micro-scaled devices B Vermeersch, G De Mey Microelectronics Reliability 46 (1), 174-177, 2006 | 44 | 2006 |
Thermoreflectance imaging of sub 100 ns pulsed cooling in high-speed thermoelectric microcoolers B Vermeersch, JH Bahk, J Christofferson, A Shakouri Journal of Applied Physics 113 (10), 104502, 2013 | 39 | 2013 |
Time and frequency domain CCD-based thermoreflectance techniques for high-resolution transient thermal imaging B Vermeersch, J Christofferson, K Maize, A Shakouri, G De Mey 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management …, 2010 | 37 | 2010 |
Thermal characterization of electronic packages using the Nyquist plot of the thermal impedance P Kawka, G De Mey, B Vermeersch IEEE Transactions on Components and Packaging Technologies 30 (4), 660-665, 2007 | 37 | 2007 |
Fractal Lévy Heat Transport in Nanoparticle Embedded Semiconductor Alloys AMS Mohammed, YR Koh, B Vermeersch, H Lu, PG Burke, AC Gossard, ... Nano letters 15 (7), 4269-4273, 2015 | 35 | 2015 |
Thermal interfacial transport in the presence of ballistic heat modes B Vermeersch, AMS Mohammed, G Pernot, YR Koh, A Shakouri Physical Review B 90 (1), 014306, 2014 | 35 | 2014 |
Non-Fourier thermal conduction in nano-scaled electronic structures B Vermeersch, G De Mey Analog Integrated Circuits and Signal Processing 55 (3), 197-204, 2008 | 35 | 2008 |
Non-Fourier thermal conduction in nano-scaled electronic structures B Vermeersch, G De Mey Mixed Design of Integrated Circuits and System, 2006. MIXDES 2006 …, 2006 | 35 | 2006 |
Quasi-ballistic thermal transport in Al0.1Ga0.9N thin film semiconductors YR Koh, MA Shirazi-HD, B Vermeersch, AMS Mohammed, J Shao, ... Applied Physics Letters 109 (24), 243107, 2016 | 33 | 2016 |
Thermal transport through Ge-rich Ge/Si superlattices grown on Ge (0 0 1) L Thumfart, J Carrete, B Vermeersch, N Ye, T Truglas, J Feser, H Groiss, ... Journal of Physics D: Applied Physics 51 (1), 014001, 2017 | 31 | 2017 |
Generation of reduced dynamic thermal models of electronic systems from time constant spectra of transient temperature responses M Janicki, J Banaszczyk, B Vermeersch, G De Mey, A Napieralski Microelectronics Reliability 51 (8), 1351-1355, 2011 | 31 | 2011 |