| A guideline for reliability prediction in power electronic converters S Peyghami, Z Wang, F Blaabjerg IEEE Transactions on Power Electronics 35 (10), 10958-10968, 2020 | 115 | 2020 |
| Simplified thermal modeling for IGBT modules with periodic power loss profiles in modular multilevel converters Y Zhang, H Wang, Z Wang, Y Yang, F Blaabjerg IEEE Transactions on Industrial Electronics 66 (3), 2323-2332, 2018 | 104 | 2018 |
| Mission profile-based system-level reliability prediction method for modular multilevel converters Y Zhang, H Wang, Z Wang, F Blaabjerg, M Saeedifard IEEE Transactions on Power Electronics 35 (7), 6916-6930, 2019 | 71 | 2019 |
| Impact of lifetime model selections on the reliability prediction of IGBT modules in modular multilevel converters Y Zhang, H Wang, Z Wang, Y Yang, F Blaabjerg 2017 IEEE Energy Conversion Congress and Exposition (ECCE), 4202-4207, 2017 | 69 | 2017 |
| Condition monitoring for submodule capacitors in modular multilevel converters H Wang, H Wang, Z Wang, Y Zhang, X Pei, Y Kang IEEE Transactions on Power Electronics 34 (11), 10403-10407, 2019 | 43 | 2019 |
| Artificial intelligence-aided thermal model considering cross-coupling effects Y Zhang, Z Wang, H Wang, F Blaabjerg IEEE Transactions on Power Electronics 35 (10), 9998-10002, 2020 | 39 | 2020 |
| Reliability modeling of power electronic converters: A general approach S Peyghami, Z Wang, F Blaabjerg 2019 20th workshop on control and modeling for power electronics (COMPEL), 1-7, 2019 | 39 | 2019 |
| Capacitor condition monitoring based on the DC-side start-up of modular multilevel converters Z Wang, Y Zhang, H Wang, F Blaabjerg IEEE Transactions on Power Electronics 35 (6), 5589-5593, 2019 | 38 | 2019 |
| The impact of mission profile models on the predicted lifetime of IGBT modules in the modular multilevel converter Y Zhang, H Wang, Z Wang, Y Yang, F Blaabjerg IECON 2017-43rd Annual Conference of the IEEE Industrial Electronics Society …, 2017 | 29 | 2017 |
| A reference submodule based capacitor condition monitoring method for modular multilevel converters Z Wang, Y Zhang, H Wang, F Blaabjerg IEEE Transactions on Power Electronics 35 (7), 6691-6696, 2019 | 27 | 2019 |
| A viable mission profile emulator for power modules in modular multilevel converters Z Wang, H Wang, Y Zhang, F Blaabjerg IEEE Transactions on Power Electronics 34 (12), 11580-11593, 2019 | 23 | 2019 |
| Simplified multi-time scale thermal model considering thermal coupling in IGBT modules Y Zhang, H Wang, Z Wang, F Blaabjerg 2019 IEEE Applied Power Electronics Conference and Exposition (APEC), 319-324, 2019 | 21 | 2019 |
| A simplification method for power device thermal modeling with quantitative error analysis Y Zhang, H Wang, Z Wang, Y Yang, F Blaabjerg IEEE Journal of Emerging and Selected Topics in Power Electronics 7 (3 …, 2019 | 18 | 2019 |
| Balanced conduction loss distribution among sms in modular multilevel converters Z Wang, H Wang, Y Zhang, F Blaabjerg 2018 International Power Electronics Conference (IPEC-Niigata 2018-ECCE Asia …, 2018 | 17 | 2018 |
| Computational-efficient thermal estimation for IGBT modules under periodic power loss profiles in modular multilevel converters Y Zhang, H Wang, Z Wang, F Blaabjerg IEEE Transactions on Industry Applications 55 (5), 4984-4992, 2019 | 14 | 2019 |
| Submodule level power loss balancing control for modular multilevel converters Z Wang, H Wang, Y Zhang, F Blaabjerg 2018 IEEE Energy Conversion Congress and Exposition (ECCE), 5731-5736, 2018 | 14 | 2018 |
| A multi-port thermal coupling model for multi-chip power modules suitable for circuit simulators ZX Wang, H Wang, Y Zhang, F Blaabjerg Microelectronics Reliability 88, 519-523, 2018 | 10 | 2018 |
| System-level power loss evaluation of modular multilevel converters Y Zhang, H Wang, Z Wang, F Blaabjerg, M Saeedifard 2019 IEEE Energy Conversion Congress and Exposition (ECCE), 6797-6804, 2019 | 9 | 2019 |
| Condition monitoring method for submodule capacitor in modular multilevel converter H Wang, H Wang, Y Zhang, Z Wang, X Pei, Y Kang 2019 IEEE Applied Power Electronics Conference and Exposition (APEC), 344-348, 2019 | 9 | 2019 |
| Impact of the thermal-interface-material thickness on IGBT module reliability in the modular multilevel converter Y Zhang, H Wang, Z Wang, Y Yang, F Blaabjerg 2018 International Power Electronics Conference (IPEC-Niigata 2018-ECCE Asia …, 2018 | 8 | 2018 |
Frede BlaabjergProfessor in Power Electronics, Villum Investigator, Aalborg University, DenmarkVerified email at et.aau.dk
