Amin Enayati
Amin Enayati
E&C Anechoic Chambers
Verified email at ecac.be
TitleCited byYear
RF probe influence study in millimeter‐wave antenna pattern measurements
K Mohammadpour‐Aghdam, S Brebels, A Enayati, R Faraji‐Dana, ...
International Journal of RF and Microwave Computer‐Aided Engineering 21 (4 …, 2011
352011
Millimeter-wave horn-type antenna-in-package solution fabricated in a teflon-based multilayer PCB technology
A Enayati, GAE Vandenbosch, W De Raedt
IEEE Transactions on Antennas and Propagation 61 (4), 1581-1590, 2013
252013
Novel low-cost end-wall microstrip-to-waveguide splitter transition
H Aliakbarian, A Enayati, GAE Vandenbosch, W De Raedt
Progress In Electromagnetics Research 101, 75-96, 2010
252010
Wideband single-layer DC-decoupled substrate integrated waveguide (SIW)-to-microstrip transition using an interdigital configuration
M Abdolhamidi, A Enayati, M Shahabadi, R Faraji-Dana
2007 Asia-Pacific Microwave Conference, 1-4, 2007
232007
Parallel–series feed network with improved G/T performance for high-gain microstrip antenna arrays
M Yousefbeigi, A Enayati, M Shahabadi, D Busuioc
Electronics Letters 44 (3), 180-182, 2008
192008
3D-antenna-in-package solution for microwave wireless sensor network nodes
A Enayati, S Brebels, W De Raedt, GAE Vandenbosch
IEEE Transactions on Antennas and Propagation 59 (10), 3617-3623, 2011
182011
Advanced microwave circuits and systems
V Zhurbenko
BoD–Books on Demand, 2010
142010
Fine pitch 3D-TSV based high frequency components for RF MEMS applications
WA Vitale, M Fernández-Bolaños, R Merkel, A Enayati, I Ocket, ...
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 585-590, 2015
112015
Diffraction analysis of periodic structures using a transmission-line formulation: principles and applications
A Fallahi, KZ Aghaie, A Enayati, M Shahabadi
Journal of Computational and Theoretical Nanoscience 4 (3), 649-666, 2007
112007
Pre-harvest annihilation of sunne-pest in winters using electromagnetic exposure
H Aliakbarian, A Enayati, S Farsi, H Ajam, H Ameri, MA Soltani
Proceedings. ICCEA 2004. 2004 3rd International Conference on Computational …, 2004
82004
Vertical via-less transition in MCM technology for millimetre-wave applications
A Enayati, S Brebels, W Deraedt, GAE Vandenbosch
Electronics letters 46 (4), 287-288, 2010
72010
Antenna-in-package solution for 3D integration of millimeter-wave systems using a thin-film MCM technology
A Enayati, S Brebels, GAE Vandenbosch, W Deraedt, AV Räisänen
2011 IEEE MTT-S International Microwave Symposium, 1-4, 2011
62011
Miniaturization of a bow-tie antenna for a pulsed-UWB transceiver in the 300–960 MHz band
S Radiom, A Enayati, GAE Vandenbosch, W De Raedt, GGE Gielen
2009 3rd European Conference on Antennas and Propagation, 3315-3317, 2009
62009
Low-radiation-loss waveguide-to-microstrip transition using a double slit configuration for microstrip array feeding
H Aliakbarian, A Enayati, M Yousefbeigi, M Shahabadi
2007 Asia-Pacific Microwave Conference, 1-4, 2007
62007
THz holographic imaging: a spatial-domain technique for phase retrieval and image reconstruction
A Enayati, A Tamminen, J Ala-Laurinaho, AV Räisänen, ...
2012 IEEE/MTT-S International Microwave Symposium Digest, 1-3, 2012
52012
LTCC antenna-in-package solution for millimeter-wave applications
A Enayati, KM Aghdam, W De Raedt, GAE Vandenbosch
2011 IEEE International Symposium on Antennas and Propagation (APSURSI), 861-864, 2011
52011
Antenna-in-package solution for millimeter-wave applications implemented in a microwave-compatible multilayer PCB technology
A Enayati, W Deraedt, GAE Vandenbosch, AV Räisänen
2011 41st European Microwave Conference, 1161-1164, 2011
42011
CPW-to-CPW transitions for 3D packaging and antenna measurement at millimetre wave frequencies
A Enayati
Proceedings of the 32nd ESA Antenna Workshop, 2010
42010
Substrate effect on X-band design of end-wall double slit microstrip-to-waveguide splitter
H Aliakbarian, A Enayati, W De Raedt, GAE Vandenbosch
2009 3rd European Conference on Antennas and Propagation, 1239-1241, 2009
42009
3D TSV based high frequency components for RF IC and RF MEMS applications
M Fernández-Bolaños, WA Vitale, MM López, AM Ionescu, A Klumpp, ...
2016 IEEE International 3D Systems Integration Conference (3DIC), 1-4, 2016
32016
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