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Co-authors
- Chun ChengSouthern University of Science and Technology of ChinaVerified email at sustech.edu.cn
- Run ShiPostdoctoral fellow, Tsinghua UniversityVerified email at mail.sustech.edu.cn
- Johnny C. HoAssociate VP (Enterprise) and Professor, Materials Science and Engin., City University of Hong KongVerified email at cityu.edu.hk
- You MENG (孟优)Ctiy University of Hong Kong, Postdoc FellowVerified email at my.cityu.edu.hk
- Sen Po YIPAssociate Professor, Kyushu UniversityVerified email at m.kyushu-u.ac.jp
- pengshan XieCityU of Hong KongVerified email at my.cityu.edu.hk
- Zhengxun Lai (赖征勋)City University of Hong KongVerified email at my.cityu.edu.hk
- Ning WangHong Kong University of Science and TechnologyVerified email at ust.hk
- Zefei Wu(吴泽飞)University of Manchester, Hong Kong University of Science & TechnologyVerified email at manchester.ac.uk
- Jun MIAOKing Abdullah University of Science and TechnologyVerified email at kaust.edu.sa
- Puttaswamy MadhusudanHanyang University, Seoul, South KoreaVerified email at hanyang.ac.kr
- Shuzhang NiuShenzhen Technology UniversityVerified email at sztu.edu.cn
- Kaihui LiuSchool of Physics, Peking Univeristy, Beijing, ChinaVerified email at pku.edu.cn
- Jingwei Wang (王经纬)Tsinghua University, Shenzhen International Graduate School (Tsinghua SIGS)Verified email at sz.tsinghua.edu.cn
- Dongyang LiThe Hong Kong Polytechnic University, SUSTechVerified email at connect.polyu.hk