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Eric PopPease-Ye Professor of Electrical Engineering & Materials Science, Stanford UniversityVerified email at stanford.edu- Wenhui DuanTsinghua University, Beijing, ChinaVerified email at tsinghua.edu.cn
- Bing HuangBeijing Computational Science Research CenterVerified email at csrc.ac.cn
- Myung-Ho BaeKorea Research Institute of Standards and Science, mhbae@kriss.re.krVerified email at kriss.re.kr
- Feng XiongAssistant Professor, Department of Electrical and Computer Engineering, University of PittsburghVerified email at pitt.edu
- Sharnali IslamUniversity of DhakaVerified email at du.ac.bd
- Yong Xu (徐勇)Professor, Department of Physics, Tsinghua UniversityVerified email at mail.tsinghua.edu.cn
- Zhun-Yong OngResearch Scientist, Institute of High Performance Computing, SingaporeVerified email at ihpc.a-star.edu.sg
- David EstradaBoise State University; Idaho National LaboratoryVerified email at boisestate.edu
- Feifei LianStanford UniversityVerified email at stanford.edu
- Max ShulakerMassachusetts Institute of TechnologyVerified email at mit.edu
- YUN HO KIMPrincipal Research Scientist, Korea Research Institute of Chemical Technology (KRICT)Verified email at krict.re.kr
- Qimin YanAssociate Professor, Department of Physics, Northeastern UniversityVerified email at northeastern.edu
- Jia Li（李佳）Associate Professor, Tsinghua Shenzhen International Graduate School (Tsingua SIGS)Verified email at mail.tsinghua.edu.cn
- Juan Pablo LlinasUniversity of California, BerkeleyVerified email at berkeley.edu
- Ashkan BehnamDevice Engineer, MicronVerified email at micron.com
- Yizhou Liu (刘易周)School of Physics Science and Engineering, Tongji UniversityVerified email at tongji.edu.cn
- Albert LiaoEmerging Memory Engineer, MicronVerified email at micron.com
- Lucas LindsayOak Ridge National LaboratoryVerified email at ornl.gov
- Michal Jakub MleczkoDevice Engineer, IntelVerified email at stanford.edu
